STACKED MICROELECTRONIC PACKAGE ASSEMBLIES AND METHODS FOR THE FABRICATION THEREOF

摘要

Stacked microelectronic package assemblies are provided, as are methods for producing stacked microelectronic package assemblies. In one embodiment, the stacked microelectronic package assembly includes a base package layer onto which a stacked bridge device is stacked. The base package layer includes, in turn, a first microelectronic package and a second microelectronic package positioned laterally adjacent the first microelectronic package. The stacked bridge device extends over the first and second microelectronic packages. A first terminal of the stacked bridge device is soldered to or otherwise electrically joined to a first backside contact of the first microelectronic package, and a second terminal of the stacked bridge device is soldered to or otherwise electrically joined to a second backside contact of the second microelectronic package.

主权项

1. A stacked microelectronic package assembly, comprising:
a base package layer, comprising:
a first microelectronic package having a first backside contact;a second microelectronic package positioned laterally adjacent the first microelectronic package and having a second backside contact; a substrate to which the first and second microelectronic packages are mounted in a laterally-spaced relationship such that neighboring sidewalls of the first and second microelectronic packages define an unfilled air gap between the first and second microelectronic packages; and a stacked bridge device stacked onto the base package layer opposite the substrate, the stacked bridge device extending from the first microelectronic package to the second microelectronic package to span the unfilled air gap, the stacked bridge device having first and second terminals soldered to first and second backside contacts, respectively.