| 摘要 |
A semiconductor device includes a semiconductor substrate, an analog circuit block including an active element arranged in the semiconductor substrate, a metal layer having a slit or a plurality of metal interconnects arranged in parallel, positioned above the analog circuit block, and a resin layer containing a filler, positioned above at least the metal layer or the plurality of metal interconnects. In the case of forming a semiconductor device by sealing a semiconductor chip with resin having a filler mixed therein, according to this semiconductor device, it is possible to suppress lowering of the level of precision of the electric characteristics of the analog circuit, and a variation in the characteristics or a change in the characteristics, in a mold packaging process, without using special materials or production methods. |
