发明名称 RESIN COMPOSITION
摘要 PURPOSE: To obtain a resin for a multilayer packaging material excellent in hot-water resistance and retorting resistance by making the resin consist of a saponified specific ethylene/vinyl ester copolymer and a specified modified polyamide. CONSTITUTION: The resin composition comprising 95-50wt.% saponified ethylene/ vinyl ester copolymer (A) of an ethylene content of 10-65mol% and 5-50wt.% polyamide (B) based on capramide, having a ratio of the number of methylene groups to that of the amide groups in the range: 4<=CH2 /NHCO<5.2, modified with a diamine compound and a carboxylic acid and having terminal amino and carboxyl group concentrations each of which is 8×10<-5> eq/g.polymer or lower. A representative example of component A is vinyl acetate. Examples of component B include various nylons desirably nylon 6, nylon 6/12 and nylon 6/6, 6 each of which has terminal groups in amounts satisfying the above range. A multilayer packaging material made thereof has excellent hot-water resistance and good heat stability in molding and is useful especially for retort-packed food.
申请公布号 JPH08259756(A) 申请公布日期 1996.10.08
申请号 JP19950069200 申请日期 1995.03.28
申请人 KURARAY CO LTD 发明人 WADA RYOICHI;TOKOO MAKIO
分类号 C08L23/26;B32B27/28;B65B55/04;C08L29/04;(IPC1-7):C08L23/26 主分类号 C08L23/26
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