发明名称 |
BONDING MEMBER, METHOD FOR PRODUCING BONDING MEMBER AND BONDING METHOD |
摘要 |
This bonding member (1) is provided with: a wire rod (2) which contains a low-melting-point metal and is provided with a hole (4); and metal grains (5) which contain a high-melting-point metal that produces an intermetallic compound having a higher melting point than the low-melting-point metal by a reaction with a melt of the low-melting-point metal, and which are inserted into the hole (4). The low-melting-point metal is, for example, Sn or an Sn alloy. The high-melting-point metal is, for example, a Cu-Ni alloy, a Cu-Mn alloy, a Cu-Cr alloy or a Cu-Al alloy. |
申请公布号 |
WO2017038418(A1) |
申请公布日期 |
2017.03.09 |
申请号 |
WO2016JP73533 |
申请日期 |
2016.08.10 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
KITAMURA, Takashi;WASHIZUKA, Seitaro |
分类号 |
B23K35/14;B23K1/00;B23K35/26;B23K35/40;B23K101/42;C22C9/00 |
主分类号 |
B23K35/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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