发明名称 BONDING MEMBER, METHOD FOR PRODUCING BONDING MEMBER AND BONDING METHOD
摘要 This bonding member (1) is provided with: a wire rod (2) which contains a low-melting-point metal and is provided with a hole (4); and metal grains (5) which contain a high-melting-point metal that produces an intermetallic compound having a higher melting point than the low-melting-point metal by a reaction with a melt of the low-melting-point metal, and which are inserted into the hole (4). The low-melting-point metal is, for example, Sn or an Sn alloy. The high-melting-point metal is, for example, a Cu-Ni alloy, a Cu-Mn alloy, a Cu-Cr alloy or a Cu-Al alloy.
申请公布号 WO2017038418(A1) 申请公布日期 2017.03.09
申请号 WO2016JP73533 申请日期 2016.08.10
申请人 MURATA MANUFACTURING CO., LTD. 发明人 KITAMURA, Takashi;WASHIZUKA, Seitaro
分类号 B23K35/14;B23K1/00;B23K35/26;B23K35/40;B23K101/42;C22C9/00 主分类号 B23K35/14
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