METHOD AND DEVICE FOR MONITORING A CUTTING WIRE WITH BONDED ABRASIVES

摘要

The cutting wire (100) has an outer surface with roughness formed by abrasive grains (103) having a given mean diameter Dg. The monitoring method includes the following steps: emitting (E0) a light beam (FL) defined by two parallel planes; moving (E1) the wire (100) through the light beam (FL) in a linear fashion, the angle between the wire (100) and the planes of the beam (FL) being comprised between 85° and 95°, in particular between 88° and 92° and more particularly equal to 90°; and, at consecutive acquisition times during the movement of the wire through the light beam, acquiring (E2) an optical signal that is formed from the emitted light beam and is partially interrupted by the wire, in a wire analysis window having a width of between Dg/2 and 4xDg, and determining, from the acquired optical signal, an apparent diameter value of the wire.