METHOD FOR GLUING INVOLVING THE USE OF A RADIATION CURABLE ADHESIVE COMPOSITION COMPRISING SHORT FIBERS

摘要

The present patent application relates to a method for gluing two adjacent substrates together by using a radiation curable adhesive composition and a use of a radiation curable adhesive composition for gluing. In particular, the method for gluing involves the use of a radiation curable adhesive composition which comprises from 0.1 wt.% to 30 wt.% of fibers compared to the total weight of the radiation curable adhesive composition, wherein the fibers have a length comprised from 100 microns to 50 mm.