SEMICONDUCTOR DIE SUBSTRATE WITH INTEGRAL HEAT SINK

摘要

One embodiment of an integrated circuit device (210) includes a semiconductor substrate (212) with a top surface (214), a bottom surface (216) opposite said top surface, and an intermediate portion (244) positioned between the top (214) and bottom (216) surfaces. The device (210) also includes interior substrate surfaces defined by at least one void (242) extending from the bottom surface (216) to the intermediate portion (244).