THERMOELECTRIC CONVERSION MODULE AND MANUFACTURING METHOD THEREOF

摘要

Provided is a thermoelectric conversion module having a high heat resistance. The thermoelectric conversion module includes a first substrate, a second substrate, a thermoelectric element, and a bonding layer. The first substrate includes a first metalized layer. The second substrate includes a second metalized layer which faces the first metalized layer. The thermoelectric element includes a chip formed from a thermoelectric material and is arranged between the first metalized layer and the second metalized layer. The bonding layer is composed of a sintered body of a metallic material of which the average crystal particle diameter is no greater than 20 μm and bonds the first metalized layer and the second metalized layer with the thermoelectric element.

主权项

1. A thermoelectric conversion module comprising:
a first substrate comprising a first metalized layer; a second substrate comprising a second metalized layer which faces the first metalized layer; a thermoelectric element which comprises a chip formed from a thermoelectric material and is arranged between the first metalized layer and the second metalized layer; and a bonding layer which is composed of a sintered body of a metallic material having an average crystal particle diameter of no greater than 20 nm and bonds the first metalized layer and the second metalized layer with the thermoelectric element.