发明名称 |
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
摘要 |
There is provided a substrate processing apparatus for processing a substrate by supplying a processing gas to the substrate while revolving the substrate, the substrate processing apparatus including: a rotary table installed within a processing container; a rotating mechanism configured to rotate the rotary table; a support part installed in a rotary shaft of the rotary table below the rotary table; an opening portion formed in the rotary table to correspond to amounting position where the substrate is mounted; a mounting part rotatably supported by the support part through the opening portion, and configured to mount the substrate thereon such that a height level of an upper surface of the substrate coincides with a height level of an upper surface of the rotary table; and a rotating mechanism configured to rotate the mounting part. |
申请公布号 |
US2017067160(A1) |
申请公布日期 |
2017.03.09 |
申请号 |
US201615255565 |
申请日期 |
2016.09.02 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
KATO Hitoshi;OHIZUMI Yukio;HONMA Manabu |
分类号 |
C23C16/455;H01L21/02;C23C16/458 |
主分类号 |
C23C16/455 |
代理机构 |
|
代理人 |
|
主权项 |
1. A substrate processing apparatus for processing a substrate by supplying a processing gas to the substrate while revolving the substrate, the substrate processing apparatus comprising:
a rotary table installed within a processing container; a rotating mechanism configured to rotate the rotary table; a support part installed in a rotary shaft of the rotary table below the rotary table; an opening portion formed in the rotary table to correspond to a mounting position where the substrate is mounted; a mounting part rotatably supported by the support part through the opening portion, and configured to mount the substrate thereon such that a height level of an upper surface of the substrate coincides with a height level of an upper surface of the rotary table; and a rotating mechanism configured to rotate the mounting part. |
地址 |
Tokyo JP |