METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE

摘要

Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka “slurry”) and an abrasive pad, e.g., CMP processing.

主权项

1. A method of polishing a dielectric-containing surface of a substrate, the method comprising:
providing a substrate comprising a surface that includes dielectric material, providing a polishing pad, providing a chemical-mechanical polishing composition comprising:
an aqueous medium,abrasive particles dispersed in the aqueous medium, andremoval rate accelerator having the formula:wherein R is selected from: straight or branched alkyl, aryl, substituted aryl, alkoxy, straight or branched halogen-substituted alkyl, halogen-substituted aryl, and halogen-substituted alkoxy,
the slurry having a pH of below about 7,contacting the substrate with the polishing pad and the chemical-mechanical polishing composition; andmoving the polishing pad and the chemical-mechanical polishing composition relative to the substrate to abrade at least a portion of the dielectric layer on a surface of the substrate to polish the substrate.