METHOD FOR MANUFACTURING HOLE-FILLING PRINTED WIRING BOARD, CURABLE RESIN COMPOSITION AND HOLE-FILLING PRINTED WIRING BOARD

摘要

A redundant part of a plated through hole that is formed in a printed wiring board is removed by a back drilling method; a penetration hole is filled entirely with a curable resin composition for hole filling; the curable resin composition is initially heated at a temperature less than 100° C. so that a curing rate of the curable resin composition may be 60% to 85%; and the curable resin composition is subsequently heated at a temperature 130° C. to 200° C. so that the curable resin composition may be cured completely, where the curable resin composition contains 1 part by mass to 200 parts by mass of a curing agent with respect to 100 parts by mass of liquid epoxy resin, and contains no solvent.

主权项

1. A method for manufacturing a hole-filling printed wiring board, comprising: removing a redundant part of a plated through hole that is formed in a printed wiring board by a back drilling method;
filling a penetration hole entirely with a curable resin composition for hole filling; initially heating the filled curable resin composition at a temperature less than 100° C. so that a curing rate of the curable resin composition becomes 60% to 85%; and subsequently heating the filled curable resin composition at a temperature 130° C. to 200° C. so as to cure the curable resin composition completely, wherein the curable resin composition contains 1 part by mass to 200 parts by mass of a curing agent with respect to 100 parts by mass of liquid epoxy resin, and contains no solvent.