| 摘要 |
This molding device for molding a metal pipe by expanding a metal pipe material is provided with: a mold which includes upper and lower molds for molding the metal pipe, of which at least one is moveable; electrodes for heating the metal pipe material by energizing the metal pipe material; a gas supply unit which supplies gas to the inside of the heated metal pipe material to expand the metal pipe; and a mold motion suppression unit which suppresses movement of the mold due to electromagnetic forces, at least during the energization of the metal pipe material by means of the electrodes. |
