| 摘要 |
The peripheral walls of this package for housing a semiconductor element consist of a first wall, a second wall, a third wall, and a fourth wall. The first wall is provided with a first fitting section, a second fitting section, and a through-hole. The second wall faces the first wall. The third wall is adjacent to the first wall and the second wall. On the third wall, a third fitting section that fits with the first fitting section is provided to a third end section, and a fourth end section is integrally connected to the second wall. On the fourth wall, a fourth fitting section that fits with the second fitting section is provided to a fifth end section, and a sixth end section is integrally connected to the second wall. |
