RESIN SUBSTRATE, COMPONENT-MOUNTING RESIN SUBSTRATE, AND METHOD FOR MANUFACTURING COMPONENT-MOUNTING RESIN SUBSTRATE

摘要

A component-mounting resin substrate (10) includes a resin substrate (20) and a component (30). The resin substrate (20) includes a thermoplastic resin element (21). The component (30) is mounted on the resin substrate (20) by ultrasonic bonding. A mounting area in the resin element (21) for the component (30) is provided with holes (23) recessed from the mounting surface for the component (30). At least part of the wall surfaces of the holes (23) has a plating layer (24) that is formed of a material harder than the resin element (21).