| 发明名称 |
Semiconductor Package and Method of Forming the Same |
| 摘要 |
A method of forming a semiconductor package includes receiving a carrier, coating the carrier with a bonding layer, forming a first insulator layer over the bonding layer, forming a backside redistribution layer over the first insulator layer, forming a second insulator layer over the backside redistribution layer, patterning the second insulator layer to form a recess that extends through the second insulator layer and to the backside redistribution layer, filling the recess with a solder, and coupling a surface-mount device (SMD) to the solder. |
| 申请公布号 |
US2017069590(A1) |
申请公布日期 |
2017.03.09 |
| 申请号 |
US201615355145 |
申请日期 |
2016.11.18 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company Limited |
发明人 |
Chen Hsien-Wei;Su An-Jhih |
| 分类号 |
H01L23/00;H01L25/10;H01L25/18;H01L21/56;H01L23/498 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming a semiconductor package, the method comprising:
receiving a carrier; coating the carrier with a bonding layer; forming a first insulator layer over the bonding layer; forming a backside redistribution layer over the first insulator layer; forming a second insulator layer over the backside redistribution layer; patterning the second insulator layer to form a recess that extends through the second insulator layer and to the backside redistribution layer; filling the recess with a solder; and coupling a surface-mount device (SMD) to the solder. |
| 地址 |
Hsinchu TW |
