| 摘要 |
The present invention provides a method for determining the front and the rear of a monocrystalline wafer, wherein the monocrystalline wafer front/rear determination method is characterized by: using, as the monocrystalline wafer, a wafer having a crystal plane that is left/right asymmetric with respect to a reference direction connecting the center of the monocrystalline wafer with the center of an orientation-specifying cutout formed on an end surface of the monocrystalline wafer; irradiating the monocrystalline wafer with X-rays and detecting the diffracted X-rays, while particularly observing the left/right asymmetric crystal plane, and thereby measuring the angle formed between the reference direction and the orientation of the crystal plane that is being particularly observed; and on the basis of the value of the measured angle, determining whether a surface of the monocrystalline wafer is the front surface or the rear surface. Due to these features, a monocrystalline wafer front/rear determination method that reliably determines the front and the rear of a monocrystalline wafer and that has excellent cost performance is provided. |
