发明名称 |
INDUCTOR DEVICE |
摘要 |
A semiconductor device includes an inductor disposed on a surface of an intermetallic dielectric layer at a location below which no virtual interconnect members are present. Thus, parasitic capacitance is reduced or eliminated and the Q value of the inductor is high. |
申请公布号 |
US2017069707(A1) |
申请公布日期 |
2017.03.09 |
申请号 |
US201615340683 |
申请日期 |
2016.11.01 |
申请人 |
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION |
发明人 |
HUANG HERB HE;GE HONGTAO;LI HAITING |
分类号 |
H01L49/02;H01L29/06;H01L23/535;H01L27/06 |
主分类号 |
H01L49/02 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device comprising:
a front-end device; an interlayer dielectric layer on the front-end device, an interconnect member within the interlayer dielectric layer and connected with the front-end device; a dielectric filling layer within the interlayer dielectric layer; an intermetallic dielectric layer on the interlayer dielectric layer; and an inductor on the intermetallic dielectric layer. |
地址 |
Shanghai CN |