| 发明名称 |
Air Trench in Packages Incorporating Hybrid Bonding |
| 摘要 |
A package component includes a surface dielectric layer including a planar top surface, a metal pad in the surface dielectric layer and including a second planar top surface level with the planar top surface, and an air trench on a side of the metal pad. The sidewall of the metal pad is exposed to the air trench. |
| 申请公布号 |
US2017069593(A1) |
申请公布日期 |
2017.03.09 |
| 申请号 |
US201615356887 |
申请日期 |
2016.11.21 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chou Bruce C.S.;Wang Chen-Jong;Liu Ping-Yin;Tu Jung-Kuo;Chou Tsung-Te;Huang Xin-Hua;Kuang Hsun-Chung;Chao Lan-Lin;Tsai Chia-Shiung;Chen Xiaomeng |
| 分类号 |
H01L23/00;H01L25/00;H01L25/065 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package comprising:
a first package component comprising:
a first surface dielectric layer;a first metal pad in the first surface dielectric layer; anda first air trench, wherein a first sidewall of the first metal pad is exposed to the first air trench; and a second package component over and bonded to the first package component, wherein the second package component comprises:
a second surface dielectric layer; anda second metal pad in the second surface dielectric layer, wherein the second package component comprises a portion exposed to the first air trench. |
| 地址 |
Hsin-Chu TW |
