| 摘要 |
<p>PURPOSE:To obtain a low-temperature calcined ceramic multilayer circuit board not having a possibility of the deterioration of an adhesive strength due to a chemical in an Au plating treatment by a method wherein an Au circuit pattern and a Cu circuit pattern or via holes come into contact to each other through a metallic paste which can be calcined at a temperature of an Au-Cu eutectic point or lower, and thereafter, are calcined in a neutral atmosphere. CONSTITUTION:A low-temperature calcined ceramic multilayer board contains alumina, borosilicate lead glass and a thermoplastic resin as its main component, an inner layer 1 having a Cu via hole 3 and a Cu circuit pattern 4 and a surface layer 2, on which an Au circuit pattern 5 is made to form so as not come into contact with a Cu via hole 3, which is formed by reducing CuO, and the Cu circuit pattern 4, are laminated, are heated and pressed and are integrally formed. The laminated material is heated at 500 deg.C in the air, is degreased, the CuO is reduced to Cu at 200 to 300 deg.C in an N2+H2 atmosphere and after that, the laminated material is calcined at 900 deg.C in an N2 atmosphere. Chip components 6 are placed between these Cu and Au patterns and are bonded to the multilayer board with a solder 7.</p> |
