| 摘要 |
<p>PURPOSE:To obtain a ceramic multilayer circuit board, which has internal wirings formed using a silver conductor and a surface wiring formed using a copper conductor, is provided with the copper conductor surface wiring having a high bonding strength, is superior in a wettability with solder and is superior in productivity, and a method of manufacturing the circuit board. CONSTITUTION:In a ceramic multilayer circuit board 10, which is provided with a glass-ceramic multilayer board 1 having internal wirings 12 formed using a silver conductor and a surface wiring 2, which is formed using a copper conductor and is formed on the main surface of the board 1, via hole conductors 14 consisting of a platinum or palladium conductor are formed at joints between the wirings 12 and the surface wiring 2. Moreover, after the wiring 2 is printed on the multilayer board 1, it is subjected to firing at a temperature of a silver- copper eutectic point or higher, such as 900 deg.C, in a neutral or reducing atmosphere.</p> |
