发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
In one embodiment, a semiconductor device comprising, a substrate comprising a wiring layer, a first conductive shielding layer disposed on the substrate and electrically isolated from the wiring layer, the first conductive shielding layer comprising a first bonding surface and a first end surface extending from the first bonding surface, a semiconductor chip disposed on the first conductive shielding layer, a molding member disposed over the first conductive shielding layer to cover the semiconductor chip, a second conductive shielding layer disposed over the first conductive shielding layer and the molding member, the second conductive shielding layer comprising a second bonding surface and a second end surface extending from the second bonding surface, and a bonding portion disposed between the first and second bonding surfaces, the bonding portion comprising a top surface and a bottom surface opposite to the top surface. The bottom surface of the bonding portion contacts the first bonding surface to form a first contact surface. The top surface of the bonding portion contacts the second bonding surface to form a second contact surface. An area of the second contact surface is larger than an area of the second end surface. |
申请公布号 |
US2017069828(A1) |
申请公布日期 |
2017.03.09 |
申请号 |
US201615227953 |
申请日期 |
2016.08.03 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
LEE Baik-Woo;SONG Eun-Seok;KIM Young-Jae;JANG Jae-Gwon |
分类号 |
H01L43/02;H01L43/08 |
主分类号 |
H01L43/02 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device comprising:
a substrate comprising a wiring layer; a first conductive shielding layer disposed on the substrate and electrically insulated from the wiring layer, the first conductive shielding layer comprising a first bonding surface and a first end surface extending from the first bonding surface; a semiconductor chip disposed on the first conductive shielding layer; a molding member disposed over the first conductive shielding layer to cover the semiconductor chip; a second conductive shielding layer disposed over the first conductive shielding layer and the molding member, the second conductive shielding layer comprising a second bonding surface and a second end surface extending from the second bonding surface; and a bonding portion disposed between the first and second bonding surfaces, the bonding portion comprising a top surface and a bottom surface opposite to the top surface, wherein the bottom surface of the bonding portion contacts the first bonding surface to form a first contact surface, and wherein the top surface of the bonding portion contacts the second bonding surface to form a second contact surface. |
地址 |
Suwon-si KR |