| 发明名称 |
LIGHT-EMITTING DIODE PACKAGE |
| 摘要 |
A light-emitting diode package is provided. The light-emitting diode package includes a lead-frame, a reflective cup and a die. The lead-frame is made of a silver-free material. The reflective cup has the cavity. The die is disposed on the lead-frame in a face-down orientation, and is further electrically connected to the lead-frame and located within the cavity. |
| 申请公布号 |
US2017069809(A1) |
申请公布日期 |
2017.03.09 |
| 申请号 |
US201615227067 |
申请日期 |
2016.08.03 |
| 申请人 |
Lextar Electronics Corporation |
发明人 |
Chen Jo-Shung;Lin Chih-Hao;Tsai Tzong-Liang |
| 分类号 |
H01L33/62;H01L33/50;H01L33/60 |
主分类号 |
H01L33/62 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light-emitting diode package, comprising:
a lead-frame made of a silver-free material; a reflective cup having a cavity; and a die disposed on the lead-frame in a face-down orientation, electrically connected to the lead-frame and located within the cavity. |
| 地址 |
Hsinchu TW |
