| 摘要 |
A power module (100) is provided with: a heatsink (106c) having a semiconductor chip, not shown in the figure, bonded thereto; a package (101) for sealing the outer periphery of the semiconductor chip so as to expose at least part of the heatsink (106c); and a thickness-controlling protrusion (104) for controlling the thickness of a heat conducting material (120) when the heatsink (106c) is bonded to a cooler (110) using the heat conducting material (120). The present invention provides a highly reliable power module, power-module heat-dissipation structure, and power-module junction method that can ensure a sufficient cooling performance and suppress deterioration due to overheating. |
