发明名称 |
AQUEOUS COPPER PLATING BATHS AND A METHOD FOR DEPOSITION OF COPPER OR COPPER ALLOY ONTO A SUBSTRATE |
摘要 |
The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions and a bisurea derivative. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures. |
申请公布号 |
WO2017037040(A1) |
申请公布日期 |
2017.03.09 |
申请号 |
WO2016EP70365 |
申请日期 |
2016.08.30 |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
BRUNNER, Heiko;KOHLMANN, Lars;WITCZAK, Agnieszka;MANN, Olivier |
分类号 |
C25D7/12;C25D3/38 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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