| 发明名称 |
DATA COMPRESSION FOR EBEAM THROUGHPUT |
| 摘要 |
Lithographic apparatuses suitable for, and methodologies involving, complementary e-beam lithography (CEBL) are described. In an example, a method of data compression or data reduction for e-beam tool simplification involves providing an amount of data to write a column field and to adjust the column field for field edge placement error on a wafer, wherein the amount of data is limited to data for patterning approximately 10% or less of the column field. The method also involves performing e-beam writing on the wafer using the amount of data. |
| 申请公布号 |
US2017069509(A1) |
申请公布日期 |
2017.03.09 |
| 申请号 |
US201415122398 |
申请日期 |
2014.12.19 |
| 申请人 |
Intel Corporation |
发明人 |
NELSON Donald W.;BORODOVSKY Yan A.;PHILLIPS Mark C.;BIGWOOD Robert M. |
| 分类号 |
H01L21/311;H01J37/317;H01J37/04;H01L21/027;H01J37/302 |
主分类号 |
H01L21/311 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of data compression or data reduction for e-beam tool simplification, the method comprising:
providing an amount of data to write a column field and to adjust the column field for field edge placement error on a wafer, wherein the amount of data is limited to data for patterning approximately 10% or less of the column field; and performing e-beam writing on the wafer using the amount of data. |
| 地址 |
Santa Clara CA US |
