PLATING MATERIAL HAVING EXCELLENT HEAT RESISTANCE AND METHOD FOR MANUFACTURING SAME

摘要

[Problem] To provide a Sn plating material capable of maintaining desired heat resistance and that does not crack during contact point formation even at a high temperature such as 175°C. [Solution] An Sn plating material (10) having a first ground layer (2) composed of Ni or a Ni alloy, an intermediate layer (4) composed of a CuSn compound, and a surface layer (5) composed of Sn or a Sn alloy in the stated order on an electroconductive substrate (1) composed of Cu or a Cu alloy, wherein the Sn plating material (10), when viewed in the cross section composed of the calendering and thickness directions, has a process-modified layer (6) with a length of 0.5 to 10 µm per 20 µm of boundary length of the first ground layer and the electroconductive substrate remaining on the surface of the electroconductive substrate, or has a plurality of process-modified layers (6) with a total length of 0.5 to 10 µm per 20 µm of boundary length.