INTEGRATED POWER MODULE PACKAGING STRUCTURE

摘要

An integrated power module packaging structure includes a housing, a first circuit board, a second circuit board, a first pin, a second pin and a third pin. The housing has a cavity. The second circuit board is located above the first circuit board, and both them are received in the cavity. A switching module is disposed on the first circuit board. A high side current/voltage detecting device and a driving device are disposed on the second circuit board. The first pin, the second pin and the third pin are disposed between the first circuit board and the second circuit board. The first pin connects the high side current/voltage detecting device and the switching module in series. The second pin connects the switching module. The driving device controls the switching module through the third pin.

主权项

1. An integrated power module packaging structure comprising:
a housing having a cavity; a first circuit board received in the cavity, wherein a switching module is disposed on the first circuit board; a second circuit board received in the cavity and located above the first circuit board, wherein a high side current/voltage detecting device and a driving device are disposed on the second circuit board; and a first pin, a second pin and a third pin disposed between the first circuit board and the second circuit board, wherein the first pin connects the high side current/voltage detecting device and the switching module in series, and the second pin connects the switching module, and the driving device controls the switching module through the third pin.