发明名称 |
DAMAGE-AND-RESIST-FREE LASER PATTERNING OF DIELECTRIC FILMS ON TEXTURED SILICON |
摘要 |
In accordance with embodiments disclosed herein, there are provided methods and systems for implementing damage-and-resist-free laser patterning of dielectric films on textured silicon. For example, in one embodiment, such means include means for depositing a Silicon nitride (SiNx) or SiOx (silicon oxide) layer onto a crystalline silicon (c-Si) substrate by a Plasma Enhanced Chemical Vapor Deposition (PECVD) processing; depositing an amorphous silicon (a-Si) film on top of the SiNx or SiOx layer; patterning the a-Si film to define an etch mask for the SiNx or SiOx layer; removing the SiNx or SiOx layer via a Buffered Oxide Etch (BOE) chemical etch to expose the c-Si surface; removing the a-Si mask with a hydrogen plasma etch in a PECVD tool to prevent current loss from the mask; and plating the exposed c-Si surface with metal contacts. Other related embodiments are disclosed. |
申请公布号 |
US2017117432(A1) |
申请公布日期 |
2017.04.27 |
申请号 |
US201615280247 |
申请日期 |
2016.09.29 |
申请人 |
Bailly Mark Scott |
发明人 |
Bailly Mark Scott |
分类号 |
H01L31/18;H01L31/068;H01L31/0216;H01L31/0224;H01L31/028 |
主分类号 |
H01L31/18 |
代理机构 |
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代理人 |
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主权项 |
1. A method comprising:
depositing a Silicon nitride (SiNx) or SiOx (silicon oxide) layer onto a crystalline silicon (c-Si) substrate by a Plasma Enhanced Chemical Vapor Deposition (PECVD) processing; depositing an amorphous silicon (a-Si) film on top of the SiNx or SiOx layer; patterning the a-Si film to define an etch mask for the SiNx or SiOx layer; removing the SiNx or SiOx layer via a Buffered Oxide Etch (BOE) chemical etch to expose the c-Si surface; removing the a-Si mask; and plating the exposed c-Si surface with metal contacts. |
地址 |
Chandler AZ US |