发明名称 LOW RESISTANCE CONTACT STRUCTURES FOR TRENCH STRUCTURES
摘要 An electrical device including at least one contact surface and an interlevel dielectric layer present atop the electrical device, wherein the interlevel dielectric layer includes at least one trench to the at least one contact surface of the electrical device. A conformal titanium liner is present on the sidewalls of the trench and is in direct contact with the at least one contact surface. The conformal titanium liner may be composed of 100 wt. % titanium, and may have a thickness ranging from 10 Å to 100 Å.
申请公布号 US2017117371(A1) 申请公布日期 2017.04.27
申请号 US201514919201 申请日期 2015.10.21
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 Adusumilli Praneet;Reznicek Alexander;van der Straten Oscar;Yang Chih-Chao
分类号 H01L29/417;H01L21/768;H01L29/78;H01L29/66;H01L23/535;H01L29/06 主分类号 H01L29/417
代理机构 代理人
主权项 1. A method of forming a contact to an electrical device comprising: forming a substantially nitrogen free titanium liner having in direct contact with sidewalls of a trench composed of an interlayer dielectric, and a base surface of the trench provided by a contact surface of the electrical device; filling the trench with a metal fill comprising ruthenium (Ru) containing material; and alloying the substantially nitrogen free conformal titanium layer with the contact surface to provide a titanium containing silicide, the nitrogen free conformal titanium layer providing both a seed layer for the metal fill and a silicide forming element.
地址 Armonk NY US