SENSING DEVICE AND METHOD FOR FORMING THE SAME

摘要

A method for forming a sensing device includes providing a first substrate. The first substrate has a first surface and a second surface opposite thereto. A sensing region is adjacent to the first surface. A temporary cover plate is provided on the second surface to cover the sensing region. The method also includes forming a redistribution layer on the second surface and electrically connected to the sensing region. The method further includes removing the temporary cover plate after the formation of the redistribution layer. The first substrate is bonded to a second substrate and a cover plate after the removal of the temporary cover plate so that the first substrate is positioned between the second substrate and the cover plate. In addition, the method includes filling an encapsulating layer between the second substrate and the cover plate to surround the first substrate.

主权项

1. A method for forming a sensing device, comprising:
providing a first substrate, wherein the first substrate has a first surface and a second surface opposite to the first surface, and wherein a sensing region is adjacent to the first surface; providing a temporary cover plate over the second surface to cover the sensing region; forming a redistribution layer over the second surface, wherein the redistribution layer is electrically connected to the sensing region; removing the temporary cover plate after the formation of the redistribution layer; bonding the first substrate to a second substrate and a cover plate after the removal of the temporary cover plate, so that the first substrate is between the second substrate and the cover plate, wherein the redistribution layer is electrically connected to the second substrate; and filling an encapsulating layer between the second substrate and the cover plate to surround the first substrate.