发明名称 CUTTING APARATUS
摘要 Disclosed herein is a cutting apparatus including a moving unit for moving a spindle to position a cutting blade, a rotary dressing mechanism for rotating a dressing grindstone on a rotational shaft parallel to the spindle, and an optical sensor for detecting the position of the outer periphery of the dressing grindstone. The cutting blade is positioned with respect to the rotary dressing mechanism depending on the position, detected by the optical sensor, of the outer periphery of the dressing grindstone, and the cutting blade is dressed by cutting into the dressing grindstone by a predetermined cutting distance.
申请公布号 US2017113322(A1) 申请公布日期 2017.04.27
申请号 US201615331450 申请日期 2016.10.21
申请人 DISCO CORPORATION 发明人 Akita Soichiro;Kiyokawa Satoshi
分类号 B24B53/12;B24B53/08 主分类号 B24B53/12
代理机构 代理人
主权项 1. A cutting apparatus comprising: a chuck table for holding a workpiece thereon; cutting means for cutting the workpiece held on said chuck table with a cutting blade mounted on a spindle, while supplying a cutting fluid to said cutting blade; moving means for moving said spindle to position said cutting blade; rotary dressing means for rotating a dressing grindstone on a rotational shaft parallel to said spindle; and an optical sensor for detecting the position of the outer periphery of said dressing grindstone, wherein said cutting blade is positioned with respect to said rotary dressing means depending on the position, detected by said optical sensor, of the outer periphery of said dressing grindstone, and said cutting blade is dressed by cutting into said dressing grindstone by a predetermined cutting distance.
地址 Tokyo JP