PRINTED CIRCUIT BOARD FLUID EJECTION APPARATUS

摘要

In an example, a method for making a fluid ejection apparatus may include forming a molding material over a fluid passage on a back surface of printhead die, embedding the printhead die in an encapsulant in a cavity in a printed circuit board such that at least one drop ejector of the printhead die is exposed at a front side of the printed circuit board, removing the encapsulant at a back side of the printed circuit board to expose the molding material, and removing the molding material to form a fluid feed slot through which fluid may flow to the fluid passage opening in the printhead die.

主权项

1. A method for making a fluid ejection apparatus, comprising:
providing a printhead die having a first surface including at least one drop ejector and a back surface including at least one fluid passage opening; forming a molding material on the back surface of the printhead die over the at least one fluid passage opening; embedding the printhead die and the molding material in an encapsulant in a cavity in a printed circuit board; removing at least a portion of the encapsulant at a back side of the printed circuit board to expose the molding material; and removing the molding material to form a fluid feed slot through which fluid may flow to the at least one fluid passage opening in the printhead die.