Semiconductor Device with Discrete Blocks

摘要

A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device using blocks, e.g., discrete connection blocks, having through vias and/or integrated passive devices formed therein are provided. Embodiments such as those disclosed herein may be utilized in PoP applications. In an embodiment, the semiconductor device includes a die and a connection block encased in a molding compound. Interconnection layers may be formed on surfaces of the die, the connection block and the molding compound. One or more dies and/or packages may be attached to the interconnection layers.

主权项

1. A semiconductor device comprising:
a top package; and a bottom package operably coupled to the top package, the bottom package comprising a die and a connection block separated from the die by a molding compound, wherein the connection block comprises a plurality of through vias and an integrated passive device, the integrated passive device comprising a surface planar with the die, the connection block, and the molding compound.