SYSTEM ON INTEGRATED CHIPS AND METHODS OF FORMING SAME

摘要

An embodiment method for forming a semiconductor package includes attaching a first die to a first carrier, depositing a first isolation material around the first die, and after depositing the first isolation material, bonding a second die to the first die. Bonding the second die to the first die includes forming a dielectric-to-dielectric bond. The method further includes removing the first carrier and forming fan-out redistribution layers (RDLs) on an opposing side of the first die as the second die. The fan-out RDLs are electrically connected to the first die and the second die.

主权项

1. A semiconductor package comprising:
a first die; a first isolation material disposed around the first die; a bonding layer over the first die and the first isolation material; a second die directly bonded to the bonding layer, wherein the second die comprises a conductive feature disposed in a dielectric layer; a second isolation material disposed around the second die; a through via extending through the first isolation material and the bonding layer to contact the conductive feature in the second die; and fan-out redistribution layers (RDLs) on an opposing side of the first die as the second die, wherein the fan-out RDLs are electrically connected to the first die and the through via.