SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

The present disclosure provides a semiconductor package that prevents a bump bridge from being formed between adjacent conductive bumps to realize a fine bump pitch when each unit circuit part is directly stacked without using a printed circuit board and a method for manufacturing the same. The semiconductor package includes a first semiconductor chip structure including a first unit circuit part, a first passivation layer disposed on the first unit circuit part, and a conductive bump electrically connected to the first unit circuit part, and a second semiconductor chip structure including a second unit circuit part, a second passivation layer having a stepped portion that is recessed inward and disposed on the second unit circuit part, and a bump pad provided in the stepped portion. The first semiconductor chip structure and the second semiconductor chip structure are stacked to allow the conductive bump to be bonded to the bump pad within the stepped portion.

主权项

1. A semiconductor package comprising:
a first semiconductor chip structure comprising a first unit circuit part, a first passivation layer disposed on the first unit circuit part, and a conductive bump electrically connected to the first unit circuit part; and a second semiconductor chip structure comprising a second unit circuit part, a second passivation layer having a stepped portion that is recessed inward and disposed on the second unit circuit part, and a bump pad provided in the stepped portion, wherein the first semiconductor chip structure and the second semiconductor chip structure are stacked to allow the conductive bump to be bonded to the bump pad within the stepped portion.