| 发明名称 |
MANUFACTURING METHOD OF PROCESSED RESIN SUBSTRATE AND LASER PROCESSING APPARATUS |
| 摘要 |
A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more. |
| 申请公布号 |
US2017120390(A1) |
申请公布日期 |
2017.05.04 |
| 申请号 |
US201615337513 |
申请日期 |
2016.10.28 |
| 申请人 |
Laser Systems Inc. ;NICHIA CORPORATION |
发明人 |
SEET Kock Khuen;HAYASHIDA Masayuki;SAKAMOTO Masakazu;TAMAKI Hiroto |
| 分类号 |
B23K26/382;B23K26/0622;B23K26/402;B23K26/082 |
主分类号 |
B23K26/382 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A manufacturing method of a processed resin substrate comprising:
preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light, wherein: in the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more. |
| 地址 |
Hokkaido JP |
