METHOD AND STRUCTURE FOR RECEIVING A MICRO DEVICE

摘要

A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

主权项

1. A display comprising:
a display substrate; an array of bottom conductive layers on the display substrate; an electrode line on the substrate; a first passivation layer spanning across the display substrate and directly over the array of bottom conductive layers a corresponding array of integrated circuit (IC) devices bonded to the array of bottom conductive layers, and embedded within the first passivation layer; wherein the first passivation layer laterally surrounds each IC device; and a transparent top conductive layer spanning directly over the first passivation layer and the array of IC devices and in electrical contact with the electrode line.