HEAT DISSIPATION CLAMP AND METHODS, DEVICES AND SYSTEMS FOR FACILITATING HEAT DISSIPATION IN OPTICAL COMMUNICATIONS MODULES

摘要

A heat dissipation system for an optical communications module is provided that includes a heat dissipation clamp having a plurality of force-application devices for applying respective, precisely-controlled forces to respective optical communications modules of an array to maintain electrical interconnectivity between the modules of the array and respective electrical sockets. The force-application devices are independent of one another such that the respective electrical interconnectivity forces applied to the respective modules are independent of one another. This independence ensures that the proper amount of electrical interconnectivity force is applied to each module of the array, which ensures that the planarity of the system PCB is maintained without the need for a backing, or bolstering, plate. Inner walls of the heat dissipation clamp are in contact with the modules so that heat generated by the modules is transferred into the heat dissipation clamp where some or all of the heat is dissipated.

主权项

1. A heat dissipation system for dissipating heat generated by a plurality of optical communications modules installed in respective sockets that are disposed on a surface of a system circuit board, the heat dissipation system comprising:
at least a first heat dissipation clamp comprising a body and N force-application devices mechanically coupled to the body, where N is a positive integer that is greater than or equal to 2, the body being mechanically coupled to the system circuit board and being made of a thermally-conductive material, each force-application device applying a respective force against a respective optical communications module that aids in maintaining electrical interconnections between the module and the respective socket.