| 发明名称 |
APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES |
| 摘要 |
A rotary chuck for processing wafer-shaped articles comprises a chuck body having a series of gripping pins that are movable by sliding horizontally and in unison relative to the chuck body from a first position in which the gripping pins are relatively more retracted into the chuck body to a second position in which the gripping pins are relatively more extended from the chuck body and in which the gripping pins are positioned so as to support a wafer-shaped article of a predetermined diameter. |
| 申请公布号 |
US2017125281(A1) |
申请公布日期 |
2017.05.04 |
| 申请号 |
US201514931577 |
申请日期 |
2015.11.03 |
| 申请人 |
LAM RESEARCH AG |
发明人 |
GLEISSNER Andreas;BRUGGER Michael;WIRNSBERGER Thomas |
| 分类号 |
H01L21/687 |
主分类号 |
H01L21/687 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A rotary chuck for processing wafer-shaped articles, comprising a chuck body having a series of gripping pins that are movable by sliding horizontally and in unison relative to said chuck body from a first position in which said gripping pins are relatively more retracted into said chuck body to a second position in which said gripping pins are relatively more extended from said chuck body and in which said gripping pins are positioned so as to support a wafer-shaped article of a predetermined diameter. |
| 地址 |
Villach AT |
