发明名称 PACKAGED ELECTRONIC DEVICE HAVING INTEGRATED ANTENNA AND LOCKING STRUCTURE
摘要 A packaged electronic device includes an integrated antenna as part of a conductive leadframe. The conductive leadframe includes a die paddle have an elongated conductive beam structure configured as a transmission line, and a ground plane structure disposed surrounding the die paddle. The ground plane includes a gap where the transmission line extends to an edge of the packaged electronic device. In one embodiment, selected leads within the leadframe are configured with conductive connective structures as ground pins, source pins, and/or wave guides. In an alternate embodiment, a portion of the integrated antenna is embedded and partially exposed within the body of the packaged electronic device.
申请公布号 US2017125881(A1) 申请公布日期 2017.05.04
申请号 US201514931750 申请日期 2015.11.03
申请人 Amkor Technology, Inc. 发明人 Mangrum Marc Alan;Cho Hyung Jun;Kim Byong Jin;Kim Gi Jeong;Bae Jae Min;Kim Seung Mo;Lee Young Ju
分类号 H01Q1/22;H01Q9/04 主分类号 H01Q1/22
代理机构 代理人
主权项 1. A packaged electronic device having an integrated antenna comprising: a substrate comprising: a first conductive die attach pad; anda first conductive lead spaced apart from a first side of the first conductive die attach pad; an electronic device electrically coupled to the first conductive lead; a package body encapsulating the electronic device and encapsulating at least portions of the first conductive die attach pad, and at least portions of the first lead; and an antenna structure comprising: one or more of the first conductive die attach pad and a second conductive lead; andan elongated conductive beam structure disposed proximate to the first side of the first conductive die attach pad, the elongated conductive beam structure electrically coupled to one or more of first conductive die attach pad and the electronic device, wherein the package body encapsulates at least portions of the elongated conductive beam structure.
地址 Tempe AZ US