| 发明名称 |
LIGHT-EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A light-emitting diode (LED) package includes an LED chip, a phosphor film adhered to a top surface of the LED chip, and a molding phosphor covering a side surface of the LED chip. |
| 申请公布号 |
US2017125647(A1) |
申请公布日期 |
2017.05.04 |
| 申请号 |
US201615216137 |
申请日期 |
2016.07.21 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
PARK HUN-YONG;KIM Choo-ho;JEONG Song-ho;LIM Jong-ho |
| 分类号 |
H01L33/50;H01L33/30;H01L33/38 |
主分类号 |
H01L33/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light-emitting diode (LED) package comprising:
a LED chip; a phosphor film on a top surface of the LED chip; and a molding phosphor covering a side surface of the LED chip. |
| 地址 |
Suwon-si KR |
