| 发明名称 |
TRANSLUCENT CONDUCTIVE FILM |
| 摘要 |
A translucent conductive film includes a film substrate, a metal wiring layer provided as a pattern, and a colored layer. The film substrate has a plurality of protrusions on a surface at a side where the metal wiring layer is provided. The metal wiring layer has a line width of greater than 5 μm but less than 8 μm, and the metal wiring layer having a thickness of greater than or equal to 0.1 μm but less than 0.5 μm. The colored layer is provided on a main surface of the metal wiring layer at a viewing side but not on a side surface of the metal wiring layer. |
| 申请公布号 |
US2017123530(A1) |
申请公布日期 |
2017.05.04 |
| 申请号 |
US201515129115 |
申请日期 |
2015.03.25 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
Takeyasu Tomohiro;Kawamoto Ikuo;Morita Hitoshi;Arima Akira |
| 分类号 |
G06F3/044 |
主分类号 |
G06F3/044 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A translucent conductive film comprising:
a film substrate, a metal wiring layer provided as a pattern, and a colored layer, the film substrate having a plurality of protrusions on a surface at a side where the metal wiring layer is provided, the metal wiring layer having a line width of greater than 5 μm but less than 8 μm, and the metal wiring layer having a thickness of greater than or equal to 0.1 μm but less than 0.5 μm, the colored layer being provided on a main surface of the metal wiring layer at a viewing side but not on a side surface of the metal wiring layer. |
| 地址 |
Ibaraki-shi, Osaka JP |
