METHOD AND APPARATUS FOR REPAIRING COMPOSITE MATERIALS

摘要

A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object, and non-conductively heating the bond interface without directly heating the surface outside of the cure zone. Non-conductively heating the bond interface may involve applying microwave radiation to the bond interface.

主权项

1. An apparatus for bonding materials, comprising:
a housing having an inner side and an opening; a plurality of microwave emitters on the inner side of the housing, wherein the housing is configured for mounting on a surface having a fault requiring repair, the housing including a flexible portion proximate the opening of the housing, the flexible portion configured to be adjacent the surface and to surround the fault so that the housing and the surface form a closed chamber; a temperature sensor configured to determine a temperature of the surface proximate the fault; and a controller configured to modulate emission of microwave radiation from the plurality of microwave emitters based on the temperature of the surface proximate the fault.