发明名称 SENSOR MOUNTING IN AN IMPLANTABLE BLOOD PUMP
摘要 Techniques for mounting a sensor are disclosed. In some implementations, a molded interconnect device carries a sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the Hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.
申请公布号 US2017119946(A1) 申请公布日期 2017.05.04
申请号 US201715408136 申请日期 2017.01.17
申请人 TC1 LLC 发明人 McChrystal Mark;Stark, III Joseph C.
分类号 A61M1/10;G01D5/14;H05K1/18;H05K3/30;A61M1/12;H05K1/11 主分类号 A61M1/10
代理机构 代理人
主权项 1. A method comprising: mounting sensors to a circuit board to form a sensor assembly; installing a mechanical carrier in a motor assembly, the mechanical carrier defining a predetermined alignment of the sensors with respect to the motor assembly; after installing the mechanical carrier in the motor assembly, placing the circuit board of the sensor assembly in the mechanical carrier; and positioning the sensors in the mechanical carrier such that the sensors are arranged in the predetermined alignment.
地址 St. Paul MN US