发明名称 |
SENSOR MOUNTING IN AN IMPLANTABLE BLOOD PUMP |
摘要 |
Techniques for mounting a sensor are disclosed. In some implementations, a molded interconnect device carries a sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the Hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board. |
申请公布号 |
US2017119946(A1) |
申请公布日期 |
2017.05.04 |
申请号 |
US201715408136 |
申请日期 |
2017.01.17 |
申请人 |
TC1 LLC |
发明人 |
McChrystal Mark;Stark, III Joseph C. |
分类号 |
A61M1/10;G01D5/14;H05K1/18;H05K3/30;A61M1/12;H05K1/11 |
主分类号 |
A61M1/10 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method comprising:
mounting sensors to a circuit board to form a sensor assembly; installing a mechanical carrier in a motor assembly, the mechanical carrier defining a predetermined alignment of the sensors with respect to the motor assembly; after installing the mechanical carrier in the motor assembly, placing the circuit board of the sensor assembly in the mechanical carrier; and positioning the sensors in the mechanical carrier such that the sensors are arranged in the predetermined alignment. |
地址 |
St. Paul MN US |