| 发明名称 |
BONDING METHOD WITH CURING BY REFLECTED ACTINIC RAYS |
| 摘要 |
A method of making a device having a component with a planar surface bonded to a supporting frame with openings therein by an adhesive layer cured by actinic rays, wherein part of the adhesive layer lies in the shadow of opaque portions of the supporting frame, involves bringing the component and supporting frame together with a layer of adhesive applied between them. The part of the adhesive layer in the shadow of the opaque portions is cured by directing actinic rays obliquely through the openings so that they are reflected internally into the part of the adhesive layer in the shadow of the opaque portions. |
| 申请公布号 |
US2017119326(A1) |
申请公布日期 |
2017.05.04 |
| 申请号 |
US201415317056 |
申请日期 |
2014.07.25 |
| 申请人 |
TELEDYNE DALSA, INC. |
发明人 |
VAN ARENDONK Anton Petrus Maria |
| 分类号 |
A61B6/00;H01L27/146;F16B11/00;G01T1/24;G01T7/00 |
主分类号 |
A61B6/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of making an integrated device having a component with a planar surface bonded to a supporting frame with openings therein by an adhesive layer cured by actinic rays, wherein part of the adhesive layer lies in the shadow of opaque portions of the supporting frame, comprising:
bringing the component and the supporting frame together with a layer of adhesive applied between them; and curing the part of the adhesive layer in the shadow of the opaque portions by directing actinic rays obliquely through the openings so that they are reflected internally into the part of the adhesive layer in the shadow of the opaque portions. |
| 地址 |
Waterloo CA |
