| 发明名称 |
INTEGRATED CONNECTOR MODULE FOR AUTOMATION OPTIMIZATION |
| 摘要 |
The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB. |
| 申请公布号 |
US2017125149(A1) |
申请公布日期 |
2017.05.04 |
| 申请号 |
US201715408063 |
申请日期 |
2017.01.17 |
| 申请人 |
Cisco Technology, Inc. |
发明人 |
Edwards William F.;Curtis George Edward;Chau Ki Yuen;Patel Sandeep Arvindkumar;Tharp Keith Frank;Johnson Robin Carol;Liu Yu;Hudson Billie Alton |
| 分类号 |
H01F27/06;H01R13/66;H01F27/29;H01R12/51;H01F27/34;H01F17/06;H01R13/6461;H01R13/719 |
主分类号 |
H01F27/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated connector module transformer (ICMt), comprising:
a wafer configured to hold a plurality of toroid elements, and wherein the wafer is comprised of two or more mechanically coupled wafer portions; a first plurality of Electro Magnetic Interference (EMI) fingers, the first plurality of EMI fingers configured to contact a ground pad of a printed circuit board (PCB); and wherein the first plurality of EMI fingers provide a low-inductance connection between the ICMt and the ground pad of the PCB. |
| 地址 |
San Jose CA US |
