| 发明名称 |
STAGE FOR CUTTING SUBSTRATE AND SUBSTRATE-CUTTING APPARATUS |
| 摘要 |
Provided are a stage for cutting a substrate and a substrate-cutting apparatus. The stage for cutting a substrate includes: a plurality of cell areas, each of the cell areas including a first opening; an edge area at an outer side of the cell areas, the edge area including a second opening having a diameter that is larger than a diameter of the first opening; a dummy area between adjacent ones of the cell areas; and a cutting groove between one of the adjacent ones of the cell areas and the dummy area or between one of the cell areas and the edge area. |
| 申请公布号 |
US2017120379(A1) |
申请公布日期 |
2017.05.04 |
| 申请号 |
US201615192910 |
申请日期 |
2016.06.24 |
| 申请人 |
Samsung Display Co., Ltd. |
发明人 |
Choi Wonwoo;Yoon Seungho;Lee Sangbong |
| 分类号 |
B23K26/142;B23K26/402;H01L21/683;B23K26/38;H01L21/67;H01L21/78 |
主分类号 |
B23K26/142 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A stage for cutting a substrate, the stage comprising:
a plurality of cell areas, each of the cell areas comprising a first opening; an edge area at an outer side of the cell areas, the edge area comprising a second opening having a diameter that is larger than a diameter of the first opening; a dummy area between adjacent ones of the cell areas; and a cutting groove between one of the adjacent ones of the cell areas and the dummy area or between one of the cell areas and the edge area. |
| 地址 |
Yongin-si KR |
