| 发明名称 |
SEALED PACKAGE INCLUDING ELECTRONIC DEVICE AND POWER SOURCE |
| 摘要 |
Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source. |
| 申请公布号 |
US2017127543(A1) |
申请公布日期 |
2017.05.04 |
| 申请号 |
US201615299941 |
申请日期 |
2016.10.21 |
| 申请人 |
Medtronic, Inc. |
发明人 |
Day John K.;Nidelkoff Michael J.;Peterson Kris A.;Ries Andrew J.;Ruben David A.;Wiklund Craig L. |
| 分类号 |
H05K5/06;A61J1/00;H05K7/14;H01M2/30;H05K5/00 |
主分类号 |
H05K5/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A hermetically-sealed package, comprising:
a housing comprising an inner surface and an outer surface; a substrate comprising a first major surface and a second major surface; an electronic device disposed on the first major surface of the substrate and comprising a device contact; and a power source disposed at least partially within the housing and comprising a power source contact; wherein the substrate is hermetically sealed to the housing such that a non-bonded electrical connection is formed between the device contact and the power source contact. |
| 地址 |
Minneapolis MN US |
