| 发明名称 |
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME |
| 摘要 |
A multilayer electronic component includes a first multilayer capacitor electrically connected to a first surface of a support plate formed of an insulating material; and first and second metal frames electrically connected to first and second ends of the support plate, respectively. The first and second metal frames extend in an amount greater than a thickness of the first multilayer capacitor so that a first end of the first and second metal frames constitutes a mounting part. |
| 申请公布号 |
US2017127520(A1) |
申请公布日期 |
2017.05.04 |
| 申请号 |
US201615182255 |
申请日期 |
2016.06.14 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK Heung Kil;PARK Jong Hwan;AHN Young Ghyu |
| 分类号 |
H05K1/18;H01G4/30;H01G4/38;H01G4/005;H01G4/232;H01G4/248;H05K1/11;H01G4/12 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multilayer electronic component comprising:
a first multilayer capacitor electrically connected to a first surface of a support plate formed of an insulating material; and first and second metal frames electrically connected to first and second ends of the support plate, respectively; wherein the first and second metal frames extend in an amount greater than a thickness of the first multilayer capacitor so that a first end of the first and second metal frames constitutes a mounting part. |
| 地址 |
Suwon-si KR |
