PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

A printed wiring board includes a multilayer body, a first wiring layer formed on first surface of the body and including first pads, a second wiring layer embedded into second surface of the body and including second and third pads, conductor posts formed on the third pads, and via conductors formed in the body and having diameter reducing toward the second surface of the body. Each third pad has metal foil formed thereon such that each post is formed on the foil, the second wiring layer is formed such that the second pads are positioned to connect an electronic component in central portion of the second surface of the body and the third pads are positioned to connect another board in outer edge portion of the second surface of the body, and the second pads are formed such that each second pad has exposed surface recessed from the second surface.

主权项

1. A printed wiring board, comprising:
a multilayer body; a first wiring layer formed on a first main surface of the multilayer body and comprising a plurality of first conductor pads; a second wiring layer embedded into a second main surface of the multilayer body on an opposite side with respect to the first surface and comprising a plurality of second conductor pads and a plurality of third conductor pads; a plurality of conductor posts each comprising a plating material and formed on the third conductor pads, respectively; and a plurality of via conductors formed in the multilayer body such that each of the via conductors has a diameter gradually reducing from the first main surface toward the second main surface of the multilayer body, wherein each of the third conductor pads has a metal foil formed thereon such that each of the conductor posts is formed on the metal foil, the second wiring layer is formed such that the plurality of second conductor pads is positioned to connect an electronic component and formed in a central portion of the second main surface of the multilayer body and that the plurality of third conductor pads is positioned to connect another wiring board and formed in an outer edge portion of the second main surface of the multilayer body, and the plurality of second conductor pads is formed such that each of the second conductor pads has an exposed upper surface recessed from the second main surface.